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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration
Livro
eBook
idioma: inglês
Editor:
Springer Nature Switzerland AG, maio de 2025 ‧
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194,66€
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SINOPSE
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789819641659 |
| Editor: | Springer Nature Switzerland AG |
| Data de Lançamento: | maio de 2025 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 645 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9789819641659 |