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Through-Silicon Vias For 3d Integration
idioma: inglês
Editor:
MCGRAW-HILL EDUCATION - EUROPE, dezembro de 2012 ‧
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217,64€
10% DESCONTO
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SINOPSE
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuitsâ€"essential for the development of low-cost, high-performance electronic and optoelectronic products.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780071785143 |
| Editor: | MCGRAW-HILL EDUCATION - EUROPE |
| Data de Lançamento: | dezembro de 2012 |
| Idioma: | Inglês |
| Encadernação: | Capa dura |
| Páginas: | 512 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Eletricidade e Energia
|
| EAN: | 9780071785143 |
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