John Lau
partilhar
bibliografia
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30%Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous IntegrationSPRINGER VERLAG, SINGAPORE06-2026170,33€
243,33€portes grátis -
30%Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous IntegrationSpringer Nature Switzerland AG05-2025151,40€
216,29€portes grátis -
3d Ic Integration And PackagingMCGRAW-HILL EDUCATION - EUROPE10-2015185,47€
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10%Diseño De AccesoriosEditorial Gustavo Gili, S.L.10-201325,48€ 10% CARTÃOportes grátis
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Through-Silicon Vias For 3d IntegrationMCGRAW-HILL EDUCATION - EUROPE12-2012152,35€
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Reliability Of Rohs-Compliant 2d And 3d Ic InterconnectsMCGRAW-HILL EDUCATION - EUROPE12-2010137,21€
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imagem não disponívelUn Chemin De VieUn Chemin De VieBAUDELAIRE16,80€portes grátis