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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration eBook
Livro
eBook
idioma: inglês
Editor:
Springer Nature Singapore, maio de 2025 ‧
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190,21€
10% DESCONTO
IMEDIATO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789819641666 |
| Editor: | Springer Nature Singapore |
| Data de Lançamento: | maio de 2025 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Coleção: | Engineering |
| Classificação Temática: |
eBooks em Inglês
>
Ciências Exatas e Naturais
>
Física
eBooks em Inglês > Engenharia > Engenharia Geral |
| EAN: | 9789819641666 |
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