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Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous Integration
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, junho de 2026 ‧
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219,00€
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DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789819568901 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | junho de 2026 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 547 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9789819568901 |