John Lau
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bibliografia
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Data Edição
Ranking
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Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous IntegrationSPRINGER VERLAG, SINGAPORE06-20260,00€
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous IntegrationSpringer Nature Switzerland AG05-20250,00€
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3d Ic Integration And PackagingMCGRAW-HILL EDUCATION - EUROPE10-20150,00€
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Through-Silicon Vias For 3d IntegrationMCGRAW-HILL EDUCATION - EUROPE12-20120,00€
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Reliability Of Rohs-Compliant 2d And 3d Ic InterconnectsMCGRAW-HILL EDUCATION - EUROPE12-20100,00€