John H. Lau
partilhar
bibliografia
formato
Livro
EBook
ordenação
Data Edição
Ranking
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Flip Chip, Hybrid Bonding, Fan-In, And Fan-Out TechnologySPRINGER VERLAG, SINGAPORE05-20240,00€
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Chiplet Design And Heterogeneous Integration PackagingSPRINGER VERLAG, SINGAPORE03-20240,00€
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Chiplet Design And Heterogeneous Integration PackagingSPRINGER VERLAG, SINGAPORE03-20230,00€
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Semiconductor Advanced PackagingSPRINGER VERLAG, SINGAPORE05-20220,00€
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Assembly And Reliability Of Lead-Free Solder JointsSPRINGER VERLAG, SINGAPORE05-20210,00€
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Semiconductor Advanced PackagingSPRINGER VERLAG, SINGAPORE05-20210,00€
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Assembly And Reliability Of Lead-Free Solder JointsSPRINGER VERLAG, SINGAPORE05-20200,00€
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Heterogeneous IntegrationsSPRINGER VERLAG, SINGAPORE04-20190,00€
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Fan-Out Wafer-Level PackagingSPRINGER VERLAG, SINGAPORE12-20180,00€
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Fan-Out Wafer-Level PackagingSPRINGER VERLAG, SINGAPORE04-20180,00€
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Advanced Mems PackagingMCGRAW-HILL EDUCATION - EUROPE12-20090,00€
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Electronics ManufacturingMCGRAW-HILL EDUCATION - EUROPE09-20020,00€