adicionar à lista de desejos
Fan-Out Wafer-Level Packaging
Editor:
SPRINGER VERLAG, SINGAPORE, abril de 2018 ‧
ver detalhes do produto
175,73€
10% DESCONTO
CARTÃO
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
portes grátis
Venda o seu livro
SINOPSE
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811088834 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | abril de 2018 |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 303 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Engenharia Geral
Livros em Inglês > Engenharia > Eletricidade e Energia |
| EAN: | 9789811088834 |
-
Heterogeneous Integrations10%SPRINGER VERLAG, SINGAPORE189,25€ 10% CARTÃOportes grátis
-
Flip Chip, Hybrid Bonding, Fan-In, And Fan-Out Technology10%SPRINGER VERLAG, SINGAPORE182,49€
202,77€portes grátis