adicionar à lista de desejos
Semiconductor Advanced Packaging
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, maio de 2021 ‧
ver detalhes do produto
189,25€
10% DESCONTO
CARTÃO
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
portes grátis
Venda o seu livro
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811613753 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | maio de 2021 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 498 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Engenharia Geral
|
| EAN: | 9789811613753 |
-
Heterogeneous Integrations10%SPRINGER VERLAG, SINGAPORE189,25€ 10% CARTÃOportes grátis
-
Fan-Out Wafer-Level Packaging10%SPRINGER VERLAG, SINGAPORE175,73€ 10% CARTÃOportes grátis