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Heterogeneous Integrations
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, abril de 2019 ‧
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189,25€
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SINOPSE
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811372230 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | abril de 2019 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 368 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9789811372230 |
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