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Semiconductor Advanced Packaging
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, maio de 2022 ‧
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148,70€
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DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789811613784 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | maio de 2022 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 498 |
| Tipo de produto: | Livro |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Engenharia Geral
|
| EAN: | 9789811613784 |
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