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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration
Book
eBook
language: english
Publisher:
Springer Nature Switzerland AG, May of 2025 ‧
see product details
194,66€
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SYNOPSIS
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789819641659 |
| Publisher: | Springer Nature Switzerland AG |
| Release Date: | May of 2025 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 645 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
|
| EAN: | 9789819641659 |