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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration

by Xuejun Fan e John Lau
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language: english
Publisher: Springer Nature Switzerland AG, May of 2025 ‧
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This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration

by Xuejun Fan e John Lau

Property Description
ISBN: 9789819641659
Publisher: Springer Nature Switzerland AG
Release Date: May of 2025
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 645
Format: Book
Categories: Books in English > Engineering > General Engineering
EAN: 9789819641659