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3d Ic Integration And Packaging

by John Lau
language: english
Publisher: MCGRAW-HILL EDUCATION - EUROPE, October of 2015 ‧
264,96€
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A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications

3d Ic Integration And Packaging

by John Lau

Property Description
ISBN: 9780071848060
Publisher: MCGRAW-HILL EDUCATION - EUROPE
Release Date: October of 2015
Language: English
Cover: Hardcover
Pages: 480
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9780071848060