Capa do artigo Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration eBook

by Xuejun Fan e John Lau
Book eBook
language: english
Publisher: Springer Nature Singapore, May of 2025 ‧
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190,21€
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Ebook for ADE
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous Integration

by Xuejun Fan e John Lau

Property Description
ISBN: 9789819641666
Publisher: Springer Nature Singapore
Release Date: May of 2025
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Engineering
Categories: eBooks in English > Science > Physical
eBooks in English > Engineering > General Engineering
EAN: 9789819641666

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