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Through-Silicon Vias For 3d Integration

by John Lau
language: english
Publisher: MCGRAW-HILL EDUCATION - EUROPE, December of 2012 ‧
217,64€
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This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuitsâ€"essential for the development of low-cost, high-performance electronic and optoelectronic products.

Through-Silicon Vias For 3d Integration

by John Lau

Property Description
ISBN: 9780071785143
Publisher: MCGRAW-HILL EDUCATION - EUROPE
Release Date: December of 2012
Language: English
Cover: Hardcover
Pages: 512
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9780071785143