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Through-Silicon Vias For 3d Integration
language: english
Publisher:
MCGRAW-HILL EDUCATION - EUROPE, December of 2012 ‧
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SYNOPSIS
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuitsâ€"essential for the development of low-cost, high-performance electronic and optoelectronic products.
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| Property | Description |
|---|---|
| ISBN: | 9780071785143 |
| Publisher: | MCGRAW-HILL EDUCATION - EUROPE |
| Release Date: | December of 2012 |
| Language: | English |
| Cover: | Hardcover |
| Pages: | 512 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9780071785143 |
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