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Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous Integration

by Kuo-Ning Chiang e John Lau
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, June of 2026 ‧
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Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous Integration

by Kuo-Ning Chiang e John Lau

Property Description
ISBN: 9789819568901
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: June of 2026
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 547
Format: Book
Categories: Books in English > Engineering > General Engineering
EAN: 9789819568901