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Cu-Interconnects, Glass, And Ai-Assisted Simulation For Chiplets And Heterogeneous Integration
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, June of 2026 ‧
see product details
219,00€
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DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789819568901 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | June of 2026 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 547 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
|
| EAN: | 9789819568901 |