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Flip Chip, Hybrid Bonding, Fan-In, And Fan-Out Technology
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, May of 2024 ‧
see product details
182,49€
10% OFF
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DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789819721399 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | May of 2024 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 501 |
| Format: | Book |
| Categories: |
Books in English
>
Science
>
Physical
|
| EAN: | 9789819721399 |
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10%Heterogeneous IntegrationsSPRINGER VERLAG, SINGAPORE189,25€ 10% CARDfree shipping
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10%Fan-Out Wafer-Level PackagingSPRINGER VERLAG, SINGAPORE175,73€ 10% CARDfree shipping