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Flip Chip, Hybrid Bonding, Fan-In, And Fan-Out Technology

by John H. Lau
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, May of 2024 ‧
202,77€
182,49€
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Flip Chip, Hybrid Bonding, Fan-In, And Fan-Out Technology

by John H. Lau

Property Description
ISBN: 9789819721399
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: May of 2024
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 501
Format: Book
Categories: Books in English > Science > Physical
EAN: 9789819721399