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Fan-Out Wafer-Level Packaging

by John H. Lau
Publisher: SPRINGER VERLAG, SINGAPORE, April of 2018 ‧
175,73€
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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

Fan-Out Wafer-Level Packaging

by John H. Lau

Property Description
ISBN: 9789811088834
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: April of 2018
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 303
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Engineering > Electricity and Energy
EAN: 9789811088834