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Chiplet Design And Heterogeneous Integration Packaging

by John H. Lau
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, March of 2023 ‧
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Chiplet Design And Heterogeneous Integration Packaging

by John H. Lau

Property Description
ISBN: 9789811999161
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: March of 2023
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 525
Format: Book
Categories: Books in English > Engineering > General Engineering
Books in English > Others
EAN: 9789811999161