adicionar à lista de desejos
Chiplet Design And Heterogeneous Integration Packaging
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, March of 2024 ‧
see product details
133,83€
10% OFF
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
free shipping
Sell your book
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811999192 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | March of 2024 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 525 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
Books in English > Others |
| EAN: | 9789811999192 |
-
Heterogeneous Integrations10%SPRINGER VERLAG, SINGAPORE189,25€ 10% CARDfree shipping
-
Fan-Out Wafer-Level Packaging10%SPRINGER VERLAG, SINGAPORE175,73€ 10% CARDfree shipping