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Heterogeneous Integrations

by John H. Lau
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, April of 2019 ‧
189,25€
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This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.

Heterogeneous Integrations

by John H. Lau

Property Description
ISBN: 9789811372230
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: April of 2019
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 368
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9789811372230