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Heterogeneous Integrations
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, April of 2019 ‧
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SYNOPSIS
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811372230 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | April of 2019 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 368 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
Books in English > Others |
| EAN: | 9789811372230 |
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Fan-Out Wafer-Level Packaging10%SPRINGER VERLAG, SINGAPORE175,73€ 10% CARDfree shipping
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