John Lau
Share
Bibliography
-
eBook10%Hybrid Bonding, Advanced Substrates, Failure Mechanisms, And Thermal Management For Chiplets And Heterogeneous IntegrationSpringer Nature Singapore05-2025190,21€
211,34€ -
eBook10%Basics Fashion Design 09: Designing AccessoriesBLOOMSBURY PUBLISHING01-202132,18€ 10% CARD
-
eBook10%Basics Fashion Design 09: Designing AccessoriesBLOOMSBURY PUBLISHING10-201232,18€ 10% CARD