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Semiconductor Advanced Packaging

by John H. Lau
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, May of 2022 ‧
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Semiconductor Advanced Packaging

by John H. Lau

Property Description
ISBN: 9789811613784
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: May of 2022
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 498
Format: Book
Categories: Books in English > Engineering > General Engineering
EAN: 9789811613784