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Semiconductor Advanced Packaging
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, May of 2022 ‧
see product details
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DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789811613784 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | May of 2022 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 498 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
General Engineering
|
| EAN: | 9789811613784 |
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