Fan-Out Wafer-Level Packaging

Name: Fan-Out Wafer-Level Packaging
Price: 135.18 EUR
Author: John H. Lau
ISBN: 9789811342660

by John H. Lau

Publisher: SPRINGER VERLAG, SINGAPORE, December of 2018 ‧ see product details

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SYNOPSIS

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

Fan-Out Wafer-Level Packaging

by John H. Lau
Property	Description
ISBN:	9789811342660
Publisher:	SPRINGER VERLAG, SINGAPORE
Release Date:	December of 2018
Dimensions:	155 x 235 x 20 mm
Cover:	Softcover
Pages:	303
Format:	Book
Categories:	Books in English > Engineering > Mechanical Engineering Books in English > Engineering > Electricity and Energy
EAN:	9789811342660