Advanced Mems Packaging

by John H. Lau, Yu Aibin, C.S. Premachandran e Cheng Kuo Lee
language: english
Publisher: MCGRAW-HILL EDUCATION - EUROPE, December of 2009 ‧
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A comprehensive guide to advanced microelectromechanical systems (MEMS) packaging methods. It presents MEMS packaging techniques such as low-temperature bonding and 3D packaging. It helps in stimulating research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability.

Advanced Mems Packaging

by John H. Lau, Yu Aibin, C.S. Premachandran e Cheng Kuo Lee

Property Description
ISBN: 9780071626231
Publisher: MCGRAW-HILL EDUCATION - EUROPE
Release Date: December of 2009
Language: English
Cover: Hardcover
Pages: 576
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9780071626231