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New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation eBook

by Nabil Shovon Ashraf, Mohaiminul Alam e Shawon Alam
language: english
Publisher: Springer International Publishing, June of 2022 ‧
33,11€
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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

by Nabil Shovon Ashraf, Mohaiminul Alam e Shawon Alam

Property Description
ISBN: 9783031020278
Publisher: Springer International Publishing
Release Date: June of 2022
Language: English
Pages: 72
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Synthesis Lectures On Emerging Engineering Technologies
Categories: eBooks in English > Engineering > General Engineering
eBooks in English > Engineering > Electricity and Energy
EAN: 9783031020278

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