Capa do artigo New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

by Mohaiminul Alam e Nabil Shovon Ashraf
language: english
Publisher: MORGAN & CLAYPOOL PUBLISHERS, February of 2016 ‧
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New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

by Mohaiminul Alam e Nabil Shovon Ashraf

Property Description
ISBN: 9781627058544
Publisher: MORGAN & CLAYPOOL PUBLISHERS
Release Date: February of 2016
Language: English
Dimensions: 152 x 229 x 20 mm
Cover: Softcover
Pages: 80
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9781627058544

MOHAIMINUL ALAM

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NABIL SHOVON ASHRAF

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