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New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

by Nabil Shovon Ashraf, Mohaiminul Alam e Shawon Alam
language: english
Publisher: Springer International Publishing AG, February of 2016 ‧
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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation

by Nabil Shovon Ashraf, Mohaiminul Alam e Shawon Alam

Property Description
ISBN: 9783031008993
Publisher: Springer International Publishing AG
Release Date: February of 2016
Language: English
Dimensions: 191 x 235 x 20 mm
Cover: Softcover
Pages: 72
Format: Book
Collection: Synthesis Lectures On Emerging Engineering Technologies
Categories: Books in English > Engineering > General Engineering
EAN: 9783031008993

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