Resultados de Pesquisa

INGLÊS

Advanced Routing Of Electronic Modules

de Michael Pecht e Yeun Tsun Wong

~~245,13€~~ 220,62€ 10% IMEDIATO

DISPONIBILIDADE IMEDIATA

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
INGLÊS

Advanced Routing Of Electronic Modules

de Michael Pecht e Yeun Tsun Wong

~~245,13€~~ 220,62€ 10% IMEDIATO

DISPONIBILIDADE IMEDIATA

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
INGLÊS

Guidebook For Managing Silicon Chip Reliability

de Gopal Rao, Michael Pecht e Riko Radojcic

55,64€ + 10% EM CARTÃO

DISPONIBILIDADE IMEDIATA

 Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
INGLÊS

Electronic Packaging Materials And Their Properties

de F. Patrick Mccluskey, Michael Pecht, Rahul Mahajan, Rakish Agarwal, Sirus Javadpour e Terrance J. Dishongh

225,25€ + 10% EM CARTÃO

DISPONIBILIDADE IMEDIATA

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
INGLÊS

Electronic Packaging Materials And Their Properties

de F. Patrick Mccluskey, Michael Pecht, Rahul Mahajan, Rakish Agarwal, Sirus Javadpour e Terrance J. Dishongh

225,25€ + 10% EM CARTÃO

DISPONIBILIDADE IMEDIATA

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
INGLÊS

Contamination Of Electronic Assemblies

de David A. Douthit, Elissa M. Bumiller e Joan Pecht

92,74€ + 10% EM CARTÃO

DISPONIBILIDADE IMEDIATA

 Contamination problems have become a major factor in the manufacture, quality, and reliability of electronic assemblies, and understanding the mechanics and chemistry of contamination is necessary for improving quality. This title presents a generalized overview of contamination problems and offers a problem-solving reference.
INGLÊS

Advanced Routing Of Electronic Modules

de Michael Pecht e Yeun Tsun Wong

~~250,10€~~ 175,07€ 30% IMEDIATO

portes grátis

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
INGLÊS

Electronic Packaging Materials And Their Properties

de F. Patrick (University Of Maryland, College Park, Usa) Mccluskey, Michael (University Of Maryland, College Park, Usa) Pecht, Rahul (University Of Maryland, College Park, Usa) Mahajan, Rakish (De Corp, Kokomo, Indiana, Usa) Agarwal, Sirus (Shiraz University, Shiraz, Iran) Javadpour e Terrance J. (Consultant, Hillsboro, Oregon, Usa) Dishongh

~~229,82€~~ 160,87€ 30% IMEDIATO

portes grátis

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
INGLÊS

Ultrasonic Welding Of Lithium-Ion Batteries

de Bongsu Kang e S. Jack Hu

ESGOTADO OU NÃO DISPONÍVEL

 Explores ultrasonic metal welding (USMW), particularly for the manufacturing of lithium-ion (li-ion) battery cells, modules, and packs as used in electric vehicles. The book focuses mainly on two-layer and multi-layer aluminum (with and without anodizing) and copper (with and without nickel coating) welding configurations.
INGLÊS

Foreign Corrupt Practices Act - Fundamentals And Practices

de Marcus Goncalves

30,60€

portes grátis

ESGOTADO OU NÃO DISPONÍVEL

 Provides a brief overview and history of the FCPA, while also describing the fundamental purpose and requirements of the law. Enforcement and penalties are also discussed. Many real-world examples are provided of FCPA violations and actions along with information on tools and services available to prevent corruption.
INGLÊS

Design Of Human-Powered Vehicles

de Mark Archibald

ESGOTADO OU NÃO DISPONÍVEL

 Examines the design of vehicles with wheels that are powered by human muscles alone. These can provide affordable, sustainable, and healthy transportation to people around the globe. Coverage includes manufacturing processes and materials, performance modeling, handling, drivetrains, structures, components, human performance, and design strategies.
INGLÊS

Thermal Management Of Microelectronic Equipment - Heat Transfer Theory, Analysis Methods, And Design Practices

de Lian-Tuu Yeh

ESGOTADO OU NÃO DISPONÍVEL

 This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

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