Electronic Packaging Materials And Their Properties
idioma: inglês
Editor:
TAYLOR & FRANCIS INC, dezembro de 1998 ‧
ver detalhes do produto
229,82€
10% DESCONTO
CARTÃO
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
portes grátis
Venda o seu livro
SINOPSE
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780849396250 |
| Editor: | TAYLOR & FRANCIS INC |
| Data de Lançamento: | dezembro de 1998 |
| Idioma: | Inglês |
| Dimensões: | 156 x 235 x 12 mm |
| Encadernação: | Capa dura |
| Páginas: | 120 |
| Tipo de produto: | Livro |
| Coleção: | Electronic Packaging |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
|
| EAN: | 9780849396250 |
LIVROS DA MESMA COLEÇÃO
-
eBook10%Advanced Routing Of Electronic ModulesCRC PRESS220,62€
245,13€ -
eBook10%Advanced Routing Of Electronic ModulesCRC PRESS220,62€
245,13€