Electronic Packaging Materials And Their Properties
idioma: inglês
Editor:
TAYLOR & FRANCIS INC, dezembro de 1998 ‧
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SINOPSE
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780849396250 |
| Editor: | TAYLOR & FRANCIS INC |
| Data de Lançamento: | dezembro de 1998 |
| Idioma: | Inglês |
| Dimensões: | 156 x 235 x 12 mm |
| Encadernação: | Capa dura |
| Páginas: | 120 |
| Tipo de produto: | Livro |
| Coleção: | Electronic Packaging |
| Classificação Temática: |
Livros em Inglês
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Engenharia
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Eletricidade e Energia
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| EAN: | 9780849396250 |
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