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Electronic Packaging Materials And Their Properties eBook
idioma: inglês
Editor:
CRC PRESS, dezembro de 2017 ‧
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225,25€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781498730860 |
| Editor: | CRC PRESS |
| Data de Lançamento: | dezembro de 2017 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Coleção: | Electronic Packaging |
| Classificação Temática: |
eBooks em Inglês
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Engenharia
>
Eletricidade e Energia
eBooks em Inglês > Engenharia > Engenharia Hidráulica |
| EAN: | 9781498730860 |
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