Through Silicon Vias
Materials, Models, Design, And Performance
idioma: inglês
Editor:
TAYLOR & FRANCIS LTD, junho de 2020 ‧
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SINOPSE
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9780367574543 |
| Editor: | TAYLOR & FRANCIS LTD |
| Data de Lançamento: | junho de 2020 |
| Idioma: | Inglês |
| Dimensões: | 156 x 234 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 216 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9780367574543 |