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ENGLISH

Advanced Routing Of Electronic Modules

by Michael Pecht e Yeun Tsun Wong

~~245,13€~~ 220,62€ 10% OFF

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
ENGLISH

Advanced Routing Of Electronic Modules

by Michael Pecht e Yeun Tsun Wong

~~245,13€~~ 220,62€ 10% OFF

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
ENGLISH

Guidebook For Managing Silicon Chip Reliability

by Gopal Rao, Michael Pecht e Riko Radojcic

55,64€ + 10% CARD

 Examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This book provides a framework for how to model the mechanism, test for defects, and avoid and manage damage.
ENGLISH

Electronic Packaging Materials And Their Properties

by F. Patrick Mccluskey, Michael Pecht, Rahul Mahajan, Rakish Agarwal, Sirus Javadpour e Terrance J. Dishongh

225,25€ + 10% CARD

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
ENGLISH

Electronic Packaging Materials And Their Properties

by F. Patrick Mccluskey, Michael Pecht, Rahul Mahajan, Rakish Agarwal, Sirus Javadpour e Terrance J. Dishongh

225,25€ + 10% CARD

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
ENGLISH

Contamination Of Electronic Assemblies

by David A. Douthit, Elissa M. Bumiller e Joan Pecht

92,74€ + 10% CARD

 Contamination problems have become a major factor in the manufacture, quality, and reliability of electronic assemblies, and understanding the mechanics and chemistry of contamination is necessary for improving quality. This title presents a generalized overview of contamination problems and offers a problem-solving reference.
ENGLISH

Advanced Routing Of Electronic Modules

by Michael Pecht e Yeun Tsun Wong

250,10€ + 10% CARD

free shipping

 Explores the fundamental theory and advanced technologies for improving routing. This book includes descriptions of timing delay, clock skew, and noise control requirements in signal integrity along with computer-aided approaches to managing these requirements in high-speed PCB/MCM routing.
ENGLISH

Electronic Packaging Materials And Their Properties

by F. Patrick (University Of Maryland, College Park, Usa) Mccluskey, Michael (University Of Maryland, College Park, Usa) Pecht, Rahul (University Of Maryland, College Park, Usa) Mahajan, Rakish (De Corp, Kokomo, Indiana, Usa) Agarwal, Sirus (Shiraz University, Shiraz, Iran) Javadpour e Terrance J. (Consultant, Hillsboro, Oregon, Usa) Dishongh

229,82€ + 10% CARD

free shipping

 Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
ENGLISH

Ultrasonic Welding Of Lithium-Ion Batteries

by Bongsu Kang e S. Jack Hu

OUT OF STOCK OR NOT AVAILABLE

 Explores ultrasonic metal welding (USMW), particularly for the manufacturing of lithium-ion (li-ion) battery cells, modules, and packs as used in electric vehicles. The book focuses mainly on two-layer and multi-layer aluminum (with and without anodizing) and copper (with and without nickel coating) welding configurations.
ENGLISH

Foreign Corrupt Practices Act - Fundamentals And Practices

by Marcus Goncalves

43,71€

free shipping

OUT OF STOCK OR NOT AVAILABLE

 Provides a brief overview and history of the FCPA, while also describing the fundamental purpose and requirements of the law. Enforcement and penalties are also discussed. Many real-world examples are provided of FCPA violations and actions along with information on tools and services available to prevent corruption.
ENGLISH

Design Of Human-Powered Vehicles

by Mark Archibald

OUT OF STOCK OR NOT AVAILABLE

 Examines the design of vehicles with wheels that are powered by human muscles alone. These can provide affordable, sustainable, and healthy transportation to people around the globe. Coverage includes manufacturing processes and materials, performance modeling, handling, drivetrains, structures, components, human performance, and design strategies.
ENGLISH

Thermal Management Of Microelectronic Equipment - Heat Transfer Theory, Analysis Methods, And Design Practices

by Lian-Tuu Yeh

OUT OF STOCK OR NOT AVAILABLE

 This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

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