Capa do artigo Electronic Packaging Materials And Their Properties
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Electronic Packaging Materials And Their Properties eBook

by Rahul Mahajan, F. Patrick Mccluskey, Sirus Javadpour, Terrance J. Dishongh, Rakish Agarwal e Michael Pecht
language: english
Publisher: CRC PRESS, December of 2017 ‧
234,51€
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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Electronic Packaging Materials And Their Properties

by Rahul Mahajan, F. Patrick Mccluskey, Sirus Javadpour, Terrance J. Dishongh, Rakish Agarwal e Michael Pecht

Property Description
ISBN: 9781498730860
Publisher: CRC PRESS
Release Date: December of 2017
Language: English
Format: eBook
Collection: Electronic Packaging
Categories: eBooks in English > Engineering > Electricity and Energy
eBooks in English > Engineering > Hydraulic Engineering
EAN: 9781498730860

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