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language: english
Publisher: TAYLOR & FRANCIS INC, December of 1998 ‧
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Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

Electronic Packaging Materials And Their Properties

by Rakish (De Corp, Kokomo, Indiana, Usa) Agarwal, Terrance J. (Consultant, Hillsboro, Oregon, Usa) Dishongh, Sirus (Shiraz University, Shiraz, Iran) Javadpour, Michael (University Of Maryland, College Park, Usa) Pecht, F. Patrick (University Of Maryland, College Park, Usa) Mccluskey e Rahul (University Of Maryland, College Park, Usa) Mahajan

Property Description
ISBN: 9780849396250
Publisher: TAYLOR & FRANCIS INC
Release Date: December of 1998
Language: English
Dimensions: 156 x 235 x 12 mm
Cover: Hardcover
Pages: 120
Format: Book
Collection: Electronic Packaging
Categories: Books in English > Engineering > Electricity and Energy
EAN: 9780849396250