Electronic Packaging Materials And Their Properties
language: english
Publisher:
TAYLOR & FRANCIS INC, December of 1998 ‧
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SYNOPSIS
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9780849396250 |
| Publisher: | TAYLOR & FRANCIS INC |
| Release Date: | December of 1998 |
| Language: | English |
| Dimensions: | 156 x 235 x 12 mm |
| Cover: | Hardcover |
| Pages: | 120 |
| Format: | Book |
| Collection: | Electronic Packaging |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
|
| EAN: | 9780849396250 |
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