10% OFF

Hf-Based High-K Dielectrics

Process Development, Performance Characterization, And Reliability

by Young-Hee Kim e Jack C. Lee
Book eBook
language: english
Publisher: Springer International Publishing AG, December of 2007 ‧
33,79€
10% OFF CARD
free shipping
Sell ​​your book
Hard breakdown and soft breakdown, particularly the Weibull slopes, were studied under constant voltage stress. The origin of soft breakdown (first breakdown) was studied and the results suggested that the soft breakdown may be due to one layer breakdown in the bilayer structure (HfO2/SiO2: 4 nm/4 nm).

Hf-Based High-K Dielectrics

Process Development, Performance Characterization, And Reliability

by Young-Hee Kim e Jack C. Lee

Property Description
ISBN: 9783031014246
Publisher: Springer International Publishing AG
Release Date: December of 2007
Language: English
Dimensions: 191 x 235 x 20 mm
Cover: Softcover
Pages: 92
Format: Book
Collection: Synthesis Lectures On Solid State Materials And Devices
Categories: Books in English > Engineering > Mechanical Engineering
EAN: 9783031014246