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Wafer-Level Chip-Scale Packaging eBook
Analog And Power Semiconductor Applications
language: english
Publisher:
SPRINGER NEW YORK, September of 2014 ‧
see product details
186,16€
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IMMEDIATE AVAILABILITY
Ebook for ADE
SYNOPSIS
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781493915569 |
| Publisher: | SPRINGER NEW YORK |
| Release Date: | September of 2014 |
| Language: | English |
| Format: | eBook |
| File Format and Compatibility: | PDF para ADE |
| Categories: |
eBooks in English
>
Engineering
>
Hydraulic Engineering
|
| EAN: | 9781493915569 |
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