Wafer-Level Chip-Scale Packaging

Name: Wafer-Level Chip-Scale Packaging
Price: 189.25 EUR
Author: Shichun Qu e Yong Liu
ISBN: 9781493954384

Analog And Power Semiconductor Applications

by Shichun Qu e Yong Liu

Publisher: SPRINGER-VERLAG NEW YORK INC., August of 2016 ‧ see product details

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SYNOPSIS

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

DETAILS

Wafer-Level Chip-Scale Packaging

Analog And Power Semiconductor Applications

by Shichun Qu e Yong Liu
Property	Description
ISBN:	9781493954384
Publisher:	SPRINGER-VERLAG NEW YORK INC.
Release Date:	August of 2016
Dimensions:	155 x 235 x 20 mm
Cover:	Softcover
Pages:	322
Format:	Book
Categories:	Books in English > Engineering > Mechanical Engineering
EAN:	9781493954384

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