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Wafer-Level Chip-Scale Packaging

Analog And Power Semiconductor Applications

by Shichun Qu e Yong Liu
language: english
Publisher: SPRINGER-VERLAG NEW YORK INC., September of 2014 ‧
189,94€
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

Wafer-Level Chip-Scale Packaging

Analog And Power Semiconductor Applications

by Shichun Qu e Yong Liu

Property Description
ISBN: 9781493915552
Publisher: SPRINGER-VERLAG NEW YORK INC.
Release Date: September of 2014
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Hardcover
Pages: 322
Format: Book
Categories: Books in English > Engineering > Mechanical Engineering
EAN: 9781493915552