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Wafer-Level Chip-Scale Packaging
Analog And Power Semiconductor Applications
language: english
Publisher:
SPRINGER-VERLAG NEW YORK INC., September of 2014 ‧
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SYNOPSIS
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9781493915552 |
| Publisher: | SPRINGER-VERLAG NEW YORK INC. |
| Release Date: | September of 2014 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Hardcover |
| Pages: | 322 |
| Format: | Book |
| Categories: |
Books in English
>
Engineering
>
Mechanical Engineering
|
| EAN: | 9781493915552 |