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Electromigration Modeling At Circuit Layout Level eBook

by Feifei He e Cher Ming Tan
language: english
Publisher: Springer Nature Singapore, March of 2013 ‧
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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

Electromigration Modeling At Circuit Layout Level

by Feifei He e Cher Ming Tan

Property Description
ISBN: 9789814451215
Publisher: Springer Nature Singapore
Release Date: March of 2013
Language: English
Format: eBook
File Format and Compatibility: PDF para ADE
Collection: Springerbriefs In Applied Sciences And Technology
Categories: eBooks in English > Science > Physical
eBooks in English > Engineering > Electricity and Energy
EAN: 9789814451215

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