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Electromigration Modeling At Circuit Layout Level
language: english
Publisher:
SPRINGER VERLAG, SINGAPORE, May of 2013 ‧
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SYNOPSIS
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
DETAILS
| Property | Description |
|---|---|
| ISBN: | 9789814451208 |
| Publisher: | SPRINGER VERLAG, SINGAPORE |
| Release Date: | May of 2013 |
| Language: | English |
| Dimensions: | 155 x 235 x 20 mm |
| Cover: | Softcover |
| Pages: | 103 |
| Format: | Book |
| Collection: | Springerbriefs In Applied Sciences And Technology |
| Categories: |
Books in English
>
Engineering
>
Electricity and Energy
Books in English > Others |
| EAN: | 9789814451208 |
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