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Electromigration Modeling At Circuit Layout Level

by Feifei He e Cher Ming Tan
language: english
Publisher: SPRINGER VERLAG, SINGAPORE, May of 2013 ‧
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Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.

Electromigration Modeling At Circuit Layout Level

by Feifei He e Cher Ming Tan

Property Description
ISBN: 9789814451208
Publisher: SPRINGER VERLAG, SINGAPORE
Release Date: May of 2013
Language: English
Dimensions: 155 x 235 x 20 mm
Cover: Softcover
Pages: 103
Format: Book
Collection: Springerbriefs In Applied Sciences And Technology
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9789814451208