Capa do artigo Electrical Modeling And Design For 3d System Integration
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Electrical Modeling And Design For 3d System Integration eBook

3d Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc

by Er-Ping Li
language: english
Publisher: WILEY, March of 2012 ‧
145,68€
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The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.

Electrical Modeling And Design For 3d System Integration

3d Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc

by Er-Ping Li

Property Description
ISBN: 9781118166741
Publisher: WILEY
Release Date: March of 2012
Language: English
Format: eBook
File Format and Compatibility:
Categories: eBooks in English > Science > Mathematics
EAN: 9781118166741
Acessibilidade: Ver características de acessibilidade indicadas pelo editor

ER-PING LI

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