10% OFF

Electrical Modeling And Design For 3d System Integration

3d Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc

by Er-Ping Li
language: english
Publisher: JOHN WILEY & SONS INC, April of 2012 ‧
148,64€
10% OFF CARD
free shipping
Sell ​​your book
The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques.

Electrical Modeling And Design For 3d System Integration

3d Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc

by Er-Ping Li

Property Description
ISBN: 9780470623466
Publisher: JOHN WILEY & SONS INC
Release Date: April of 2012
Language: English
Cover: Hardcover
Pages: 384
Format: Book
Categories: Books in English > Engineering > Electricity and Energy
Books in English > Others
EAN: 9780470623466