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Wafer-Level Chip-Scale Packaging eBook
Analog And Power Semiconductor Applications
idioma: inglês
Editor:
SPRINGER NEW YORK, setembro de 2014 ‧
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186,16€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781493915569 |
| Editor: | SPRINGER NEW YORK |
| Data de Lançamento: | setembro de 2014 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Classificação Temática: |
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| EAN: | 9781493915569 |
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