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Wafer-Level Chip-Scale Packaging eBook
Analog And Power Semiconductor Applications
idioma: inglês
Editor:
SPRINGER NEW YORK, setembro de 2014 ‧
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186,16€
10% DESCONTO
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
DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781493915569 |
| Editor: | SPRINGER NEW YORK |
| Data de Lançamento: | setembro de 2014 |
| Idioma: | Inglês |
| Tipo de produto: | eBook |
| Classificação Temática: |
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| EAN: | 9781493915569 |
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