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Wafer-Level Chip-Scale Packaging
Analog And Power Semiconductor Applications
idioma: inglês
Editor:
SPRINGER-VERLAG NEW YORK INC., setembro de 2014 ‧
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189,94€
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SINOPSE
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9781493915552 |
| Editor: | SPRINGER-VERLAG NEW YORK INC. |
| Data de Lançamento: | setembro de 2014 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa dura |
| Páginas: | 322 |
| Tipo de produto: | Livro |
| Classificação Temática: |
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| EAN: | 9781493915552 |