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New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation eBook
idioma: inglês
Editor:
Springer International Publishing, junho de 2022 ‧
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33,11€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783031020278 |
| Editor: | Springer International Publishing |
| Data de Lançamento: | junho de 2022 |
| Idioma: | Inglês |
| Páginas: | 72 |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Coleção: | Synthesis Lectures On Emerging Engineering Technologies |
| Classificação Temática: |
eBooks em Inglês
>
Engenharia
>
Engenharia Geral
eBooks em Inglês > Engenharia > Eletricidade e Energia |
| EAN: | 9783031020278 |
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