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New Prospects Of Integrating Low Substrate Temperatures With Scaling-Sustained Device Architectural Innovation
idioma: inglês
Editor:
Springer International Publishing AG, fevereiro de 2016 ‧
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33,79€
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SINOPSE
In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783031008993 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | fevereiro de 2016 |
| Idioma: | Inglês |
| Dimensões: | 191 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 72 |
| Tipo de produto: | Livro |
| Coleção: | Synthesis Lectures On Emerging Engineering Technologies |
| Classificação Temática: |
Livros em Inglês
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| EAN: | 9783031008993 |
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