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Electromigration Modeling At Circuit Layout Level
idioma: inglês
Editor:
SPRINGER VERLAG, SINGAPORE, maio de 2013 ‧
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SINOPSE
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9789814451208 |
| Editor: | SPRINGER VERLAG, SINGAPORE |
| Data de Lançamento: | maio de 2013 |
| Idioma: | Inglês |
| Dimensões: | 155 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 103 |
| Tipo de produto: | Livro |
| Coleção: | Springerbriefs In Applied Sciences And Technology |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
Livros em Inglês > Outros |
| EAN: | 9789814451208 |
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