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Die-Stacking Architecture
Livro
eBook
idioma: inglês
Editor:
Springer International Publishing AG, junho de 2015 ‧
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47,30€
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SINOPSE
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783031006197 |
| Editor: | Springer International Publishing AG |
| Data de Lançamento: | junho de 2015 |
| Idioma: | Inglês |
| Dimensões: | 191 x 235 x 20 mm |
| Encadernação: | Capa mole |
| Páginas: | 113 |
| Tipo de produto: | Livro |
| Coleção: | Synthesis Lectures On Computer Architecture |
| Classificação Temática: |
Livros em Inglês
>
Engenharia
>
Eletricidade e Energia
|
| EAN: | 9783031006197 |
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