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Die-Stacking Architecture eBook
Livro
eBook
idioma: inglês
Editor:
Springer International Publishing, maio de 2022 ‧
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46,36€
10% DESCONTO
CARTÃO
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DISPONIBILIDADE IMEDIATA
Ebook para ADE
SINOPSE
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
DETALHES
| Propriedade | Descrição |
|---|---|
| ISBN: | 9783031017476 |
| Editor: | Springer International Publishing |
| Data de Lançamento: | maio de 2022 |
| Idioma: | Inglês |
| Páginas: | 113 |
| Tipo de produto: | eBook |
| Formato e Compatibilidade: | PDF para ADE |
| Coleção: | Synthesis Lectures On Computer Architecture |
| Classificação Temática: |
eBooks em Inglês
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Eletricidade e Energia
eBooks em Inglês > Informática > Sistemas Operativos e Redes |
| EAN: | 9783031017476 |
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